An Investigation into the Failure Characteristics of External PCB Traces with Different Angle Bends

Abstract The design of a Printed Circuit Board (PCB) involves satisfying numerous constraints in terms the positioning components and routing conducting tracks or traces between components. One common constraint is limiting maximum angular bend that trace can make (e.g. to 45°) for several potential reasons including reliability. In this paper, we systematically investigate failure characteristics PCB external with different angle bends understand implications modern context manufacturing processes. This destructive testing straight no bends, only 45° 90° bends. There are three aspects testing: (1) maximal current testing, which withstand before measured, (2) location i.e. failed on segment at bend, (3) time testing. We did not find large difference currents be withstood by traces, However, some interesting results significantly more likely fail than take much longer average given test current.